A teardown made by patent and technology firm, Chipworks, of the new Galaxy S6 flagship reveals the device's components.
The model used in Chipworks' teardown labs is the 4G+ version of Galaxy S6 bearing model number SM-G920I, which suggests Samsung is using STMicroelectronics touch screen controller. A number of Chinese companies such as Synaptic, Cypress and Atmel usually win the order for the controller.
Apart from this, multiple chips in the Galaxy S6 have been identified . These include:
- Samsung Exynos 7420 SoC
- Samsung K3RG3G30MM-DGCH 3Gb LPDDR4 SDRAM and Samsung KLUBG4G1BD 32GB NAND Flash
- Samsung Shannon 333 Modem, Shannon 533 PMIC, Samsung S2MPS15 PMIC, Samsung Shannon 928 RF Transceiver and Samsung Shannon 710 Envelope Tracking IC
- Broadcom BCM4773 GNSS Location Hub
- InvenSense MPU-6500 Gyro + Accelerometer
- Skyworks SKY78042 Multimode Multiband (MMMB) Front-End Module (FEM)
- Avago AFEM-9020 PAM and Avago ACPM-7007 PAM
- Samsung C2N8B6 Image Processor
- Maxim MAX98505 Class DG Audio Amplifier and Maxim MAX77843 Companion PMIC
- Samsung Electro-Mechanics 3853B5 Wi-Fi Module
- N5DDPS2 (Likely Samsung NFC Controller (P/N needs to be confirmed)
- Wolfson WM1840 Audio CODEC
- Texas Instruments BQ51221 Single Chip Wireless Power Receiver
- Skyworks SKY13415 Antenna Switch
- STMicro FT6BH Touch Screen Controller
The teardown includes analysis of the Exynos 7420 octa-core application processor, which Samsung claims, is the world's first 14nm mobile processor with 64-bit computing support. According to Chipworks, the die size of Exynos 7420 is 78 mm2, which is quite smaller to the size of the Snapdragon chip, 118.3 mm2, used in the Galaxy S5.
More details about the teardown are available on the Chipworks site.